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Control And Test

AOI:  All components’ values, solders, and solders directions on the board are assembled by automatic machines and are checked optically by the AOL machines.   

ICT: By using automatic machines that have EC Testjet and TA Testjet, the products’ values, tolerances, directions of all components, materials, PCB, and production problems (which can hinder the board from running) can be identified in a short time. By using this technology, solders of BGA and uBGA can also be checked. 

X-RAY:  With state of the art X-ray devices, solder quality of BGA and SMD materials are checked before and after reflow.

MOI:  The values, solders, and directions of all components on the electronic boards are checked manually with cameras and magnifiers.

SPC: In order to check the SMT assembly process the solder height on the Electronic boards where the solder printings are done are checked using an SPC machine.

ESS:Aging test,shock,test,temperature and humidity tests.


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Smt Lines

OME Electronic is the factory which has the most improved equipment and production techniques of Turkey in TH and SMD assembly.