OME Electronic has the necessary equipment for the quality control and test phases. Electronic boards go through many component assembly and operation phases making it essential to check the power of the circuits. Thus, each step is meticulously monitored by using the most up to date technology. By having the latest equipment for the production process potential problems are identified quickly and prevented.

Our control test machines consist of the following:

OME Electronic is aware that quality control and the test phase are important elements in the production process and have the required technologic equipment.

• MSD: Sensitive materials such as BGA and uBGA are stored in environments where MSD measures are taken. In order that they aren’t harmed BGA and uBGA are kept in MSD cabinets where they can be monitored by performing automatic measurement recordings. 
• AOI: All components’ values, solders, and solders directions on the boards are assembled by automatic machines and are checked optically by the AOL machines. 
• ICT: By using automatic machines that have EC Testjet and TA Testjet, the products’ values, tolerances, and directions of all components, materials, PCB, and production problems which can hinder the board from running can be identified in a short time. By using this technology, solders of BGA and uBGA can also be checked. 
• X-RAY: With state of the art X-ray devices, solder quality of BGA and SMD materials are checked before and after reflow.
• MOI: The values, solders, and directions of all components on the electronic boards are checked manually with cameras and magnifiers.
• SPC: In order to check the SMT assembly process the solder height on the Electronic boards where the solder printings are done are checked using an SPC machine.